Reinventing Semiconductor Packaging: AI, Physics and Geometry in Action

In this episode of our podcast, “Reinventing Semiconductor Packaging: AI, Physics and Geometry in Action,” we explore how cutting-edge technologies are transforming the way chips are built. From leveraging AI for smarter designs to applying physics and geometry for precision, discover the innovations shaping next-generation semiconductor packaging.#Semiconductors #ChipDesign #TechInnovation #Electronics #AIinSemiconductors #AdvancedPackaging #GeometryInAction #PhysicsDrivenDesign #FutureOfTech #EngineeringExcellence #SmartManufacturing #NextGenChipsThanks for tuning in to "Advantest Talks Semi"! If you enjoyed this episode, we'd love to hear from you! Please take a moment to leave a rating on Apple Podcast. Your feedback helps us improve and reach new listeners. Don't forget to subscribe and share with your friends. We appreciate your support!

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