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Breaking News To Trading Moves

Nvidia and Intel's $5B AI Chip Partnership Analysis

19 Sep 2025

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Nvidia to invest $5B in Intel and co-develop AI infrastructure and PC chipsWinners Intel ($INTC) — Fresh $5B equity capital plus a multi-year collaboration with Nvidia validates Intel’s roadmap, supports balance-sheet repair, and channels demand into Intel’s x86, foundry, and advanced-packaging offerings. Nvidia ($NVDA) — Gains a powerful second-source and co-design partner for AI data centers and AI PCs, improving supply-chain resilience and opening custom x86/RTX system paths alongside existing platforms. Super Micro Computer ($SMCI) — A broader Nvidia-Intel AI portfolio expands server reference designs SMCI can ship, sustaining high-mix AI rack growth across enterprise and cloud buyers. Dell Technologies ($DELL) — As a top OEM for AI servers and workstations, benefits from new Nvidia-Intel platforms that widen enterprise SKUs and accelerate AI PC refresh cycles. Micron ($MU) — More AI servers and accelerated PCs translate into heavier HBM/DRAM pull-through per node, lifting content per system and pricing power in high-performance memory.Losers Advanced Micro Devices ($AMD) — A tighter Nvidia-Intel stack pressures AMD’s CPU + Instinct GPU positioning across AI data centers and AI PCs, challenging its attach rates and platform wins. Qualcomm ($QCOM) — Intel-Nvidia x86 AI PC chips threaten momentum for Windows-on-ARM laptops, blunting QCOM’s share gains and software ecosystem tailwinds in premium notebooks. ARM Holdings ($ARM) — An x86-centric AI PC push with Nvidia slows ARM’s near-term share capture in PCs, reducing the urgency for OEMs to migrate away from x86 designs. GlobalFoundries ($GFS) — Intel’s improved standing as a custom silicon and packaging partner may crowd out GFS on advanced AI-adjacent programs where customers want deeper Nvidia alignment. Marvell Technology ($MRVL) — Nvidia’s expanding NVLink and in-house interconnect roadmap narrows openings for third-party AI networking silicon, limiting upside in high-bandwidth data-center fabrics.

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