02:04 科意如何应对先进封装的技术挑战？04:06 科意 Batch ALD 技术在 CoWoS 中的应用06:07 从两个方向入手来面对成膜中不同的产品需求。10:09 设备公司的发展路径：探索商业模式的优劣势与风险挑战14:12 应用材料,ASML,科意三家半导体头部企业的抗周期经营策略16:14 本土设备化与国产替代：竞争还是协同？——外资设备厂的视角18:14 积极面对激烈竞争，中国半导体设备公司展现活力与潜力！20:15 中国市场需求推动科意公司发展，工程师年轻化带来挑战与机遇22:16 中国半导体设备：实现跟跑到并跑状态的认知误区是什么？当摩尔定律放缓，3D封装成了延续性价比的必经之路。炉管式薄膜沉积设备“隐形冠军”Kokusai Electric（科意半导体）如何在前道与先进封装交汇口再下一城？本期《芯片揭秘》对话科意半导体全球副总裁中国区董事长徐若松，拆解科意Batch ALD设备在CoWoS、3D NAND上的工艺秘密，复盘外资设备商在华20 年本土化 2.0 打法。合作洽谈添加微信: xinpianjiemi01(添加请备注：粉丝)发布平台：微信公众号|喜马拉雅|小宇宙|微博|知乎|雪球|搜狐网|网易新闻|bilibili|今日头条|视频号|支付宝|抖音|快手|小红书|欢迎粉丝们积极在评论区和我们留言互动哦，同时欢迎大家提出你们最想知道的芯片问题，优质提问将有机会得到产业大咖一对一解答！千万别错过~（Audio downloaded on [Coverr](httpscoverr.co))
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