产业大新闻：武汉新芯三维晶圆堆叠技术取得重大突破！该技术是武汉新芯继NOR Flash、MCU之外的第三大技术平台，并且居于国际领先水平。三维晶圆堆叠技术可以将三种不同功能晶圆整合，以完成更薄、更低功耗、更低延迟与更高性能的芯片。想了解更多内容吗，快来听一听这期的芯片揭秘吧~（由《芯片揭秘》打造团队知识解密打造的全新栏目《税眼看新闻》上线啦！这里有最专业的新政解读，最前沿的税法要闻，快来点击芯片揭秘主播页面参与收听吧。）【栏目简介】本栏目由艾新学院院长谢志峰博士，茄子烩曹幻实，茄子烩特聘顾问陈大明和喜马拉雅联合制作。不因器小，只为其重；不观其貌，只听其闻。这是一场芯片科普的声音盛宴：芯片不再那么神秘遥远，谈话间早已揭秘本质；这是一回芯片行业的热点探讨：不在背后看事件，只在台前解未来；这是一次科技公司的发声机会，默默无闻本无趣，闲情谈话出牛人；不论是科普、探讨还是发声，我们都将为转型升级中的中国提供新行业视野，窥见“中国芯”的未来。感谢您的关注，欢迎留言探讨！
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