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科技報橘

科技早餐 03/27| 美國 AI 晶片新規即將上路,科技大廠面臨挑戰

26 Mar 2025

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* 美國 AI 晶片新規即將上路,科技大廠面臨挑戰 * 全球晶圓廠設備支出持續成長,台灣穩居前三 * 阿里巴巴創辦人示警,AI 資料中心恐現泡沫 * 亞馬遜測試 AI 購物與健康助理,擴展生成式 AI 版圖 * 微軟 Security Copilot 新增 AI 代理,強化資安防禦 延伸閱讀 📖 【AI 智慧大工廠台北場 會後報導】產發署、工研院、台達、KUKA 機器人專家共探 AI Robot 應用新篇章 https://buzzorange.com/techorange/2025/03/25/2025-smart-manufacturing-taipei-ai-robot/ -- Hosting provided by SoundOn

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