Andrew Feldman

speaker

226 appearances 4 recordings 1 series first heard May 2026 last heard 24 Jul

Andrew Feldman’s voice in public audio — every appearance, attributed to the second.

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recordings per month · last 12 months

Recordings per month over the last 12 months — 4 in all, peaking in Jun 2026 with 2.

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Bloomberg Tech · OpenAI Unveils First Custom AI Chip With Broadcom · 24 Jun 2026 podcast

Yeah, that's a a a really good point.

Because of our innovative architecture, because of our wafer scale approach,

we don't use HBM.

HBM is a type of D RAM and it's made by three companies, one of whom is reporting shortly, right?

That's Micron, Heinex, and Samsung.

There's a global shortage, it's extremely expensive, lead times are long and we don't use it.

So we have a tremendous advantage there.

The other constraints in the supply chain for uh for many are COAS, which is a process inside of TSMC.

Again, we don't use it.

Right.

And the third is uh capacity at the three nanometer node.

That's space in in TSMC's factory that makes three nanometer chips.

Again, we don't use it.

We we're at the five nanometer node.

So our architecture has allowed us to deliver the fastest inference in the world by an order of magnitude while avoiding uh the the the main supply

uh supply chain constraints faced by by

Oh for sure.

signed we signed we look for example, we we signed uh uh uh our contract with OpenAI on December twenty fourth uh and had them in full production on February first.

That that's unheard of stuff.

Ed, one of the things we've been saying all along is that this market is enormous and is uh going to be met with a heterogeneous uh collection of of architectures for hardware.

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