Steve Burke
speaker
449 appearances
1 recordings
1 series
first heard Jul 2026
last heard 15 Jul
Steve Burke’s voice in public audio — every appearance, attributed to the second.
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recordings per month · last 12 monthsRecordings per month over the last 12 months — 1 in all, peaking in Jul 2026 with 1.
Appearances
Oh, as far as why more for regular, that part's easy.
That's just because the HBM itself takes a lot of the same machines as consumer memory.
And so if you're making more HBM, you're naturally making less consumer, which I think is where you start seeing the supply squeeze and the price go up.
Likewise...
Um, a single piece of HBM can use up to something.
I think it's like, I don't know.
It might be like 32 dies max or something of DRAM.
Um, you'll commonly see like four referenced, but single piece of HBM will take more DRAM dies.
Um,
to build.
And so one of the problems is if, let's just say four, if you have a piece of HPM that's got four DRAM dies in it and you have one failure somewhere in that stack or in packaging and assembly,
Now you've destroyed four individual pieces rather than if you have a yield failure with a consumer device, you destroy one piece.
No, a die is... So a wafer...
We'll start at the wafer level.
A wafer is just a disc, right?
It looks like a CD, typically 8 or 12 inches.
And they process it and they pattern it, or they literally project a pattern, or they lithographically etch a pattern onto the surface of this disc.
Once that's done, these patterns, they're called patterns because it's a repeating...
sort of um set of shapes that ultimately form the logic that makes the silicon and the the word die comes from the process dicing so with a wafer when they're done producing it and patterning it and it's basically ready to become a product they need to cut that disc into a bunch of small squares right so it's like a big slab that they cut up
Yeah, it's like making a pizza with a pizza cutter.
Showing 121–140 of 449 · page 7 of 23
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