hybrid bonding

concept
1 mentions 1 recordings first heard Jul 2026 last heard 28 Jul ±0 this week

Advanced semiconductor packaging technique linking stacked chiplets

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Gilad LuriaIsraeli Technology Founders Speak: Conversations with Successful Israeli Hitech and Biotech Entrepreneurs · Gilad Luria of Scenera · 6:11 · 28 Jul
…What we are doing is enabling in the uh I would say most advanced process in and in packaging, which is called hybrid bonding, we are able to inspect each and every such interconnection or every pair.…
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